Bright Gold 0.2mm Multilayer IC Substrate with 25μm Line Width and 0.3mm Thickness for Semiconductor Packaging
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Bright Gold 0.2mm Multilayer IC Substrate
Applications
- Semiconductor packaging and IC substrates
- Memory cards (MicroSD, MicroTF)
- Wearable electronics and MEMS/CMOS devices
- NAND/Flash memory packages and RF modules
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.3mm |
| Copper Weight | 0.5oz or Custom |
| Layer Count | 4 Layers (Customizable) |
| Surface Finish | Immersion Gold (Custom: OSP, Silver, Tin) |
| Soldermask | Green or Custom (TAIYO INK Brand) |
Material Options
Primary brands include SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly,
Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Manufacturing Capability
HOREXS-Hubei operates from a 60,000 sqm facility with $300M USD investment,
producing 600,000 SQM/year of IC substrates using Tenting & SAP processes.
Advanced Technology Support
- Line/Space: 20/20μm to 10/10μm capability
- BT+ABF material processing
- Wire bonding and flip-chip CSP substrates
- Embedded memory IC substrates and RF modules
- Multi-layer buildup with buried/blind vias
Inquiry Requirements
- Complete substrate production specifications
- Gerber and drilling files
- Quantity requirements including samples
- Layer stack-up information for multi-layer designs
Shipping & Logistics
Global shipping via DHL, UPS, FedEx, and air freight with customized
express solutions available.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu