FBGA Package Substrate with BT 40μm Core - 25μm Line Width, 0.18mm Thickness for Memory IC Applications
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
FBGA Package Substrate with BT 40μm Core
Advanced IC substrate solution designed for high-performance memory packaging applications with precision manufacturing capabilities.
Applications
Memory package, Memory packaging substrate, DRAM/SSD/LPDDR package substrate, FC package substrate, FlipChip substrate, Flipchip BGA substrate, IC package, Semiconductor package, Memory electronics, NAND/Flash memory
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others |
| Surface Finish | Mainly immersion gold, customizable options including OSP/Immersion silver, tin, and more |
| Copper | 0.5oz or Customizable |
| Layers | 1-6 layers (Customizable) |
| Soldermask | Green or Customizable (Brands: TAIYO INK, ABQ) |
Manufacturing Capabilities
HOREXS-Hubei, part of HOREXS Group, operates from a 60,000 square meter facility in Huangshi City, Hubei Province, China. With over $300 million USD investment, our annual IC substrate production capacity reaches 600,000 square meters using Tenting & SAP processes.
Advanced Technology Features
- Line/Space capability: 20/20μm, 10/10μm
- BT+ABF materials support
- Wire bonding substrate technology
- Embedded memory IC substrate solutions
- MEMS/CMOS, Module (RF, Wireless, Bluetooth)
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP and ultra IC package substrate
Inquiry Requirements
- Substrate production specification information
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
Get Better Pricing & Quality
Contact HOREXS for competitive pricing and high-quality IC substrate solutions. We provide technical support to help optimize your costs while maintaining quality standards.
Shipping Options
DHL, UPS, FedEx, Air freight, and customized express services available.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu