DRAM Memory Semiconductor Packaging Substrate - 25μm Line Width, 0.15mm Thickness, 1-6 Layer Customizable
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
DRAM Memory Semiconductor Packaging Substrate
Applications
- Memory package and packaging substrate solutions
- DRAM, SSD, LPDDR package substrates
- IC and semiconductor packaging
- NAND/Flash memory electronics
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.15mm |
| Copper Weight | 0.5oz or Custom |
| Layer Count | 1-6 layers (Customizable) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion Gold (Standard), OSP, Immersion Silver, Tin (Customizable) |
| Soldermask | Green (Standard), Custom colors (TAIYO INK, ABQ brands) |
Manufacturing Capabilities
HOREXS-Hubei operates a 60,000 square meter facility with annual IC substrate capacity of 600,000 SQM. Advanced Tenting & SAP processes support line spacing down to 10/10μm with BT+ABF materials.
Technical Support Services
- Wire bonding substrates (BGA)
- Embedded memory IC substrates
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
- 2/4/6 layer buildup structures with buried/blind vias
- Flipchip CSP packaging
Inquiry Requirements
- Complete substrate production specifications
- Gerber and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Global shipping support via DHL, UPS, FedEx, and air freight services.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu