ENIG Wire Bond BGA Package Substrate 0.18mm Thickness 1-6 Layers IC Packaging
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
ENIG Wire/DIE Bond BGA Package Substrate
Key Applications
- IC substrate packages
- WiFi and Bluetooth modules
- Memory packaging (DRAM, SSD, LPDDR)
- NAND/Flash memory substrates
- Semiconductor packaging
- MEMS/CMOS modules
- RF and wireless modules
Technical Specifications
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.18mm |
| Copper Weight | 0.5oz or Customized |
| Layer Count | 1-6 layers (Customizable) |
| Surface Finish | Immersion Gold (ENIG), OSP, Immersion Silver, Tin |
| Soldermask | Green or Customized (TAIYO INK, ABQ brands) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
Manufacturing Capabilities
Advanced Technology Features
- Line/Space: 20/20μm, 10/10μm capability
- BT+ABF material processing
- Wire bonding substrate fabrication
- Embedded memory IC substrates
- Flipchip CSP technology
- Buildup structures with buried/blind vias
- Tenting & SAP processes
Production Capacity
- Annual output: 600,000 square meters
- Factory area: 60,000 square meters
- Investment: Over $300 million USD
Inquiry Requirements
- Complete substrate production specifications
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Shipping & Support
Available shipping methods: DHL, UPS, FedEx, Air freight
Technical support available for large volume customers
Contact Horexs for competitive pricing and quality IC substrates
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu