HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
Verified Supplier
16 Years
Since 2010
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IC Chip Substrate Fabrication with BT Materials 1mil Line Width 0.18mm Thickness ENIG/ENEPIG Surface Finish

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
IC Substrate Manufacturing Capabilities
Applications
  • IC substrate package
  • WiFi module / Bluetooth module
  • Memory package and packaging substrate
  • DRAM / SSD / LPDDR package substrate
  • Semiconductor package and memory electronics
  • NAND / Flash memory
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.18mm
Material Brands SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic
Surface Finish Immersion gold (ENIG), OSP, Immersion silver, tin, custom options
Copper Weight 0.5oz or customizable
Layers 1-6 layers (customizable)
Soldermask Green or customizable (TAIYO INK, ABQ brands)
Manufacturing Excellence
HOREXS Manufacturing Facility

HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. Our state-of-the-art facility spans over 60,000 square meters with an investment exceeding $300 million USD.

Production Capacity & Technology
  • Annual IC Substrate Capacity: 600,000 SQM
  • Tenting & SAP process technologies
  • Advanced line capabilities: L/S 20/20μm, 10/10μm
  • BT + ABF materials compatibility
Advanced Technology Support
  • Wire bonding substrate (BGA)
  • Embedded memory IC substrate
  • MEMS / CMOS modules
  • RF, Wireless, Bluetooth modules
  • 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
  • Buildup technology with buried/blind vias
  • Flipchip CSP and ultra IC package substrates
Inquiry Requirements

For accurate quotations and technical support, please provide:

  • Substrate production specification information
  • Gerber files and drilling files
  • Quantity requirements including samples
  • For multilayer substrates: layer stack-up/build-up information
Get Started Today

For better pricing and superior quality IC substrates, contact HOREXS now. Our mission is to help you save costs while maintaining high quality standards.

Shipping Options
  • DHL / UPS / FedEx
  • Air freight
  • Custom express services

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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