HongRuiXing (Hubei) Electronics Co.,Ltd.
                                                                                                           
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China BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness for sale

BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness

Price Negotiable
Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Product Description
BGA Memory Substrate with ENEPIG/ENIG Surface Finish
High-performance MicroSD/TF memory substrate designed for advanced semiconductor packaging applications including DRAM, SSD, and LPDDR memory modules.
Key Applications
  • Memory package substrates
  • DRAM/SSD/LPDDR package substrates
  • Semiconductor packaging solutions
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness BT Material (0.1-0.4mm)
Surface Finish ENEPIG, Immersion Gold (Custom: OSP, Immersion Silver/Tin)
Copper Weight 0.5oz (Customizable)
Layer Count 1-6 Layers (Customizable)
Soldermask Green Standard (Custom Colors Available)
Tenting Process 20/20μm Improved Process
Material Options
Premium materials from leading brands including SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others.
Inquiry Requirements
  • Substrate production specification information
  • Gerber files with drilling data
  • Quantity requirements including samples
  • Layer stack-up information for multilayer substrates
Manufacturing Capabilities
HOREXS Hubei facility spans 60,000 square meters with $300 million investment, producing 600,000 SQM/year of IC substrates using advanced Tenting & SAP processes.
Advanced Technology Support
  • Line/Space: 20/20μm to 10/10μm
  • BT+ABF material compatibility
  • Wire bonding substrates (BGA)
  • Embedded memory IC substrates
  • MEMS/CMOS modules
  • RF, Wireless, Bluetooth modules
  • 2/4/6 layer buildup with buried/blind vias
  • Flipchip CSP packaging
Shipping & Logistics
Global shipping support via DHL, UPS, FedEx, and air freight with customized express options.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company HongRuiXing (Hubei) Electronics Co.,Ltd.
Location Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person Mark Liu

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