MCP Package Substrate 0.5oz Copper Custom BT Material - 1-6 Layers, 25μm Line Width
Price:
US 120-150 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
MCP Package Substrate Manufacturing
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with 60,000 square meters of production space and over $300 million USD investment. Annual production capacity reaches 600,000 square meters with advanced Tenting & SAP processes.
Primary Applications
- Memory package substrates
- DRAM/SSD/LPDDR package substrates
- Semiconductor packaging
- MEMS/CMOS modules
- RF, Wireless, Bluetooth modules
Technical Specifications
| Parameter | Specification |
|---|---|
| Copper Thickness | 0.5oz (Standard), Customizable |
| Minimum Line Space/Width | 1mil (25μm) |
| Layer Count | 1-6 Layers (Customizable) |
| Finished Thickness (FR4) | 0.1-0.4mm |
| Advanced Technology | L/S 20/20μm, 10/10μm |
| Materials Supported | BT+ABF materials, SHENGYI, Mitsubishi, Rogers, and others |
| Surface Finish | Immersion Gold, ENEPIG, OSP, Immersion Silver/Tin |
Manufacturing Capabilities
- Wire bonding substrates (BGA)
- Embedded memory IC substrates
- Flipchip CSP technology
- Buildup processes with buried/blind vias
- 2/4/6 layer configurations (1+2+1/2+2+2/1+4+1)
Inquiry Requirements
- Substrate production specification information
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Shipping & Support
Global shipping via DHL, UPS, FedEx, and air freight. Technical support available for large volume customers with cost-saving solutions and guaranteed high quality.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu