Flip Chip CSP Package Substrate 5x5mm Green BT Material 0.3mm Thickness 25μm Line Width
Price:
US 85-100 per square meter
MOQ:
1 square meter
Delivery Time:
7-10 working days
Brand:
Horexs
Product Description
Flip Chip CSP Package Substrate Overview
This 5x5mm green BT material substrate is engineered for advanced flip chip CSP packaging applications, offering superior performance in high-density electronic devices.
Key Applications
Ideal for IC assembly in mobile phones, smartphones, digital cameras, semiconductor packaging, consumer electronics, computers, servers, and network devices including Bluetooth and RF modules.
- DRAM and SRAM memory modules
- Smart mobile device processors (AP, baseband)
- Fingerprint sensors and biometric devices
- Network communication modules
Technical Specifications
| Parameter | Specification |
|---|---|
| Package Size | 5x5mm |
| Material | BT (Bismaleimide Triazine) - Green Color |
| Minimum Line Space/Width | 1mil (25μm) |
| Finished Thickness | 0.3mm |
| Flip Chip Pitch Support | Up to 35μm peripheral |
| Copper Weight | 0.5oz (Customizable) |
| Layer Count | 1-6 layers (Customizable) |
Material & Finish Options
Core Materials
SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, and others
Surface Finishes
Immersion gold (primary), OSP, immersion silver, tin plating, and custom options
Solder Mask
Standard green or custom colors using TAIYO INK and ABQ brands
Environmental Compliance
Manufactured to meet halogen-free and lead-free requirements for environmentally-friendly products
Manufacturing Capabilities
HOREXS-Hubei operates from a 60,000 square meter facility with annual IC substrate capacity of 600,000 square meters. Advanced technology supports line/space down to 20/20μm and 10/10μm with BT+ABF materials.
Production Requirements
For quotation and production, please provide:
- Complete substrate specification information
- Gerber files and drilling files
- Quantity requirements including samples
- For multilayer substrates: layer stack-up/build-up information
Shipping & Logistics
Global shipping via DHL, UPS, FedEx, air freight, and custom express services
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
HongRuiXing (Hubei) Electronics Co.,Ltd.
Location
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
Contact Person
Mark Liu