C11000 PCB Copper Foil
C11000 PCB Copper Foil
| GB/T | DIN | EN | ASTM |
| TU2 | E Cu58 | Cu ETP | C11000 |
Material introduction:C11000(Cu ETP)
Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy it is not suitable for processing (annealing welding etc.) and use in high temperature ( temperature greater than 370 ° C ) reducing gas. Because it is prone to hydrogen embrittlement when the material is heated to 600 ° C or higher the oxygen inside the material will form water vapor with the hydrogen in the air causing the internal structure of the material to be brittle and cremated so hydrogen embrittlement occurs.
Material Features:
1. Cu copper content is greater than 99.9% oxygen content 5-40 PPM
2. Compared with oxygen-free copper C10200 OFC the processing cost is lower.
3. Not suitable for use at temperatures above 370 ° C prone to hydrogen embrittlement
4. Widely used in electronic parts of electrical components, electrical products
Physical properties
Density(g/cm3) | 8.9 |
Electrical conductivity{IACS%(20℃)} | 100 |
Modulus of elasticity(KN/mm2) | 127 |
Thermal conductivity{W/(m*K)} | 394 |
Coefficient of thermal expansion (10-6/℃ 20/℃~100/℃) | 17.7 |
Mechanical Properties
Temper | Tensile Strength | Elongation A50 | Hardness |
(Rm,Mpa) | % | HV | |
0 | 195min | 35min | 60max |
1/4H | 215-255 | 25min | 55-100 |
1/2H | 255-315 | 15min | 75-120 |
H | 290min | 5min | 80 |
Chemical composition
| Cu | ≥99.90 |
O | 0.005-0.040 |
Application
Conductive parts, exchanger coils, heat exchangers
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