9um 12um 18um 35um High Density FPC PCB Copper Foil
9um 12um 18um 35um High Density FPC PCB Copper Foil
Specification:
Thickness: 9µm～35µm
Performances:
The product surface is black or red, has lower surface roughness.
Applications:
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features:
High density, high bending resistance and good etching performance.
Microstructure:
Table1- Performance:
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
|
Cu Content |
% |
≥99.8 |
||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
|
Tensile Strength |
R.T.(23℃) |
Kg/mm2 |
≥28 |
|||
|
H.T.(180℃) |
≥15 |
≥15 |
≥15 |
≥18 |
||
|
Elongation |
R.T.(23℃) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
|
H.T.(180℃) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
|
Matte(Rz) |
≤2.5 |
|||||
|
Peel Strength |
R.T.(23℃) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
|
Degraded rate of HCΦ(18%-1hr/25℃) |
% |
≤7.0 |
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|
Change of color(E-1.0hr/200℃) |
% |
Good |
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|
Solder Floating 290℃ |
Sec. |
≥20 |
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|
Appearance(Spot and copper powder) |
---- |
None |
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|
Pinhole |
EA |
Zero |
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|
Size Tolerance |
Width |
mm |
0~2mm |
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|
Length |
mm |
---- |
||||
|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
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Why Choose us Civen as your supplier?
1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!
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