Shenzhen Linmao Electronic Material Co.,Ltd.
                                                                                                           
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Heat Resistant Double Sided Thermal Adhesive Tape 1.0W/M.K Die Cut Acrylic Material

Price Negotiable
Price: Negotiation
MOQ: Negotiation
Delivery Time: 3~8 Days
Product Description

Heat-Resistant Double Sided Thermal Adhesive Tape 1.0W/m.K

 

Configuration of thermal adhesive tape

 

Sheet form/roll form/die-cut parts

 

Feature
High tacky thermal conductive PSA.
Only pressure is needed to form an excellent bond and thermal interface.
The performance of thermal conductivity, insulation, buffer and high tacky make it as the best choice for electronic application.
Flexible and conformable. Ideal for uneven surfaces.
Stable and economical with different thicknesses and constructions.

 

Available thickness of thermal adhesive tape

 

 

M-TS010 double sided thermal adhesive tape typical properties

 

Reinforced Material

 

Fiberglass

 

Fiberglass

 

Fiberglass

 

Fiberglass

 

Fiberglass

 

Fiberglass

 

Fiberglass

 

Thickness

 

0.1mm

 

0.15mm

 

0.2mm

 

0.25mm

 

0.3mm

 

0.4mm

 

0.5mm

 

Peel Strength (PSTC-101)(N/25mm)

 

>13.72

 

>13.72

 

>13.72

 

>13.72

 

>13.72

 

>13.72

 

>13.72

 

Temp Resistance(S) °C (°F)

 

180 (356)

 

180 (356)

 

180 (356)

 

180 (356)

 

180 (356)

 

180 (356)

 

180 (356)

 

Temp Resistance(L)°C (°F)

 

120 (248)

 

120 (248)

 

120 (248)

 

120 (248)

 

120 (248)

 

120 (248)

 

120 (248)

 

Continues Use. Temp. (°C)

 

-20 to 120

 

-20 to 120

 

-20 to 120

 

-20 to 120

 

-20 to 120

 

-20 to 120

 

-20 to 120

 

Adhesion

Retention
(1Kg/Inch/25°C)

 

>48

 

>48

 

>48

 

>48

 

>48

 

>48

 

>48

 

Adhesion(Kg/Inch)

 

1.1

 

1.4

 

1.4

 

1.4

 

1.4

 

1.4

 

1.4

Initial Bonding
Strength(Kg/Inch)

 

0.6

 

1.3

 

1.3

 

1.3

 

1.3

 

1.3

 

1.3

 

Electrical

 

Breakdown Voltage

 

2

 

2.5

 

3.5

 

4.0

 

6.0

 

6.7

 

7.0

 

Thermal

Thermal conductivity
(ASTM D5470)

 

1.0W/M.K

 

1.0W/M.K

 

1.0W/M.K

 

1.0W/M.K

 

1.0W/M.K

 

1.0W/M.K

 

1.0W/M.K

 

Thermal conductive tape application

 

1, For CPU, LED, PPR heat sink,microprocessor

2, Fixing heat sink on the power supply circuit board

3, Fixing heat sink on vehicle control circuit board

4, Replacing screws,fasteners and other fix means

 

 

Detailed Images

 

 

 

 

Packing & Shipping

 

 

 

FAQ ​                                                                                                                                  

Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.

 

Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Linmao Electronic Material Co.,Ltd.
Location 201, Building A, N0.60, Xiakeng 2nd Road, Tongde Community, Baolong Street, Longgang District, Shenzhen
Contact Person Linda

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