Product Description

High Thermal Conductive Silicone Pad

    High thermal conductive silicone pad is a high thermal conductivity material. The raw material is made of Japan Electrochemical High Thermal Conductive Spherical Alumina Powder and Dow Corning Polymer. It is a cost-effective thermal gap filling material. The surface's natural micro-viscosity and softness can well fill the air gaps to transfer the heat between the heat source and the heat sink to improve heat dissipation and improve the efficiency of heating electro-nic components and service life. It is an ideal thermal interface material.

Features & Benefits

l Cost-effective, high conductivity, low thermal resistance

l Soft and flexible, reducing the interface thermal resistance

l High electrical insulation to protect electronic devices

l Natural sticky, easy application, reworkable

l Meet ROHS and UL environmental requirements

Typical Applications

l High thermal conductivity module

l new energy vehicles

l Microprocessors, memory chips and graphics processors

l Network communication equipment

l Car equipment, charger

l High-speed hard disk drive

Physical Properties