RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit
The RT/duroid 6035HTC PCB is engineered from high-frequency circuit materials designed specifically for high-power RF and microwave applications. Utilizing ceramic-filled PTFE composites, this PCB is an exceptional choice for demanding environments where thermal management and performance are critical. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, it ensures efficient heat dissipation, making it ideal for high-power applications.
Key features of the RT/duroid 6035HTC PCB include a dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and 23°C, along with an impressive dissipation factor of 0.0013 at the same frequency and temperature. The material exhibits a thermal coefficient of dielectric constant of -66 ppm/°C and a moisture absorption rate of just 0.06%. Additionally, with a thermal conductivity of 1.44 W/m/K at 80°C, this PCB provides excellent thermal performance, contributing to lower operating temperatures and enhanced reliability in high-power scenarios.
| RT/duroid 6035HTC Typical Value | |||||
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
| Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes | ||||
| PCB Material: | Ceramic-filled PTFE composites |
| Designation: | RT/duroid 6035HTC |
| Dielectric constant: | 3.50±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
The construction of this PCB features a 2-layer rigid stackup, comprising 35 μm of copper on both layers and a 0.762 mm (30 mil) core of RT/duroid 6035HTC. Precise board dimensions of 49.23 mm x 55.55 mm (± 0.15 mm) are complemented by a finished board thickness of 0.83 mm and a minimum trace/space of 6/5 mils. With a minimum hole size of 0.6 mm and no blind vias, this PCB is crafted to meet stringent performance specifications. The immersion gold surface finish ensures excellent solderability, while the blue top solder mask enhances visibility during assembly.
This PCB is compatible with the Gerber RS-274-X artwork format and adheres to the IPC-Class-2 quality standard, ensuring it meets industry expectations. Additionally, it is available for worldwide, making it accessible to engineers globally.
Typical applications for the RT/duroid 6035HTC PCB include high-power RF and microwave amplifiers, couplers, filters, combiners, and power dividers. With its advanced thermal management capabilities and excellent high-frequency performance, this PCB is an invaluable asset for modern electronic designs demanding reliability and efficiency.
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