Taconic RF-35TC 2oz RF PCB Board 60mil Thick For Power Amplifier
High Frequency PCB Built on Taconic RF-35TC DK3.5 With 60mil Thick and Immersion Gold for Power Amplifier
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we introduce a type of high frequency PCB built on RF-35TC.
RF-35TC is a PTFE based, ceramic filled fiberglass high frequency material from Taconic company.
The specifications of PCB are as follows
Double sided, substrate is RF-35TC, DK at 3.5; 105mm long by 87mm wide; finished PCB thickness at 1.6mm, finished copper weight at 2oz; No solder mask and silkscreen; surface finish is Immersion gold
This is the stack up drawing.
Top layer and bottom layer are 2oz finished copper, dielectric material RF-35TC is in the middle at 1.524mm thick, DK at 3.5
The basic colour of RF-35TC PCB is brown and grey. Its main applications are power amplifiers, couplers and filters. In addition, It’s also widely used in antennas, satellite equipment and so on.
| PCB Capability | |
| PCB Material: | PTFE based ceramic filled fiberglass substrate |
| Designator: | RF-35TC |
| Dielectric constant @ 10GHz: | 3.50 |
| Layer count: | 2 Layer, Multilayer, Hybrid type |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 0.3mm, 0.6mm, 0.8mm, 1.6mm |
| (10mil, 20mil, 30mil, 60mil substrate) | |
| Solder mask: | Green, Red, Black, White, Blue etc. |
| PCB size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
We can provide you with double sided board, multilayer board and hybrid board. Thickness ranges from 0.3mm to 1.6mm, maximum size at 400 mm by 500mm; there’re surface finishes of bare copper, hot air level, immersion gold etc.
RF-35TC offers superior heat dissipation performance, so it's a type of thermally conductive low loss laminate. It's best suited for high power applications. Heat dissipates away from both transmission line on PCB and surface mount components such as capacitor etc.
Should you have any questions, please feel free to contact us.
Thank you for reading.
Appendix: Data sheet RF-35TC
| RF-35TC TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.5.1(modified) | 3.5 | 3.5 | ||
| Tck(-30 to 120℃) | IPC-650 2.5.5.5.1(modified) | ppm | 24 | ppm | 24 |
| Df @10 GHz | IPC-650 2.5.5.5.1(modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6(in-Plane,Two Pins in Oil) | kV | 56.7 | kV | 56.7 |
| Dielectric Strength | ASTM D 149(Through Plane) | V/mil | 570 | V/mm | 22,441 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 304 | Seconds | 304 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.05 | % | 0.05 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 12,900 | N/mm2 | 88.94 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 11,700 | N/mm2 | 80.67 |
| Tensile Strength(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 9,020 | N/mm2 | 62.19 |
| Tensile Strength(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 7,740 | N/mm2 | 53.37 |
| Elongation at Break(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.89 | N/mm | 1.89 |
| Elongation at Break(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.7 | % | 1.7 |
| Young's Modulus(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 667,000 | N/mm2 | 4,599 |
| Young's Modulus(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 637,000 | N/mm2 | 4,392 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.18 | 0.18 | ||
| Poisson's Ratio(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.23 | 0.18 | ||
| Compressive Modulus | ASTM D 695(23℃) | psi | 560,000 | N/mm2 | 3,861 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.46 x 106 | N/mm2 | 10,309 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.50 x 106 | N/mm2 | 10,076 |
| Peel Stength(½ oz.CVH) | IPC-650 2.4.8(Thermal Stress.) | Ibs./inch | 7 | g/cm3 | 1.25 |
| Thermal Conductivity(Unclad,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.6 | W/(mK) | 0.6 |
| Thermal Conductivity(C1/C1,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.92 | W/(mK) | 0.92 |
| Thermal Conductivity(CH/CH,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.87 | W/(mK) | 0.87 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.23 | mm/M | 0.23 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.64 | mm/M | 0.64 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | -0.04 | mm/M | -0.04 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.46 | mm/M | 0.46 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 8.33 x 107 | Mohms | 8.33 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 6.42 x 107 | Mohms | 6.42 x 107 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 5.19 x 108 | Mohms/cm | 5.19 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 2.91 x 108 | Mohms/cm | 2.91 x 108 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 11 | ppm/℃ | 11 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 13 | ppm/℃ | 13 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 34 | ppm/℃ | 34 |
| Density | ASTM D 792 | g/cm3 | 2.35 | g/cm3 | 2.35 |
| Hardness | ASTM D 2240(Shore D) | 79.1 | 79.1 | ||
| Strain at Break(MD) | ASTM D 790/IPC-650 2.4.4 | % | 0.014 | % | 0.014 |
| Strain at Break(CD) | ASTM D 790/IPC-650 2.4.4 | % | 0.013 | % | 0.013 |
| Specific Heat | ASTM E 1269-05,E 967-08,E968-02 | j/(g℃) | 0.94 | j/(g℃) | 0.94 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 788 | ℃ | 420 |
| Td(5% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 817 | ℃ | 436 |
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