8 Zones Lead Free Reflow Oven Advanced SMT Reflow Oven

Application

Reflow oven machine is a kind of soldering equipment used to solder SMT components and circuit boards with solder paste in the SMT production process. The reflow oven machine melts the solder paste printed on the pads of the circuit board through the temperature difference of multiple temperature zones inside the furnace body, so that the passive pins of the chip components mounted on the pads and the pads are fused and welded Together, the chip components and the circuit board pads are firmly soldered together through the cooling system in the reflow oven. The function of the reflow oven machine is to provide a kind of heating environment, so that the solder paste is heated and melted, so that the surface mount component and the PCB pad can be reliably combined with the solder paste alloy.

Features

1. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion

2. The upper cover of the oven is raised by electric handspike, safe and credible

3. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity, with auto chain lubricating system

4. SMEMA compatible

5. Even temperature and high heat compensation efficiency,especially suitable for soldering of BGA CSP components.

6 Quick warm up, it takes less than 20 minutes to heat fromthe normal temperature to the working temperature

7. Powerful programming software’s controlling system, it can detect the online temperature of PCB and can analysis save and print the profiles

Specifications