UNIQUE AUTOMATION LIMITED
                                                                                                           
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Since 2010
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2000mm/ Min 11KW Lead Free Reflow Oven 10 Zones Benchtop Reflow Oven

Price Negotiable
Price: Negotiable
MOQ: 1 unit
Delivery Time: 5-30 days
Brand: UA
Product Description

SMT Reflow Oven

Lead Free 10 Zones Reflow Oven Euiqpment

 

Basic information of Reflow Oven RF-1010I Equipment

Model RF-1010I
Weight 2200KG
PCB Conveyor Method Mesh and Rails
Mesh Width 450 MM
Cooling Method Air Oven : Forced Air;
Nitrogen Oven : Water Chiller
No. of Cooling Zones 2
Dimension ( L*W*H ) 5700*1300*1450
Normal Operation Power About 11KW
Temperature Deviation on PCB ± 1.5C
Conveyor Height 900± 20 MM
No. of Heating Zones Top10 & Bottom 10
Components Clearance Top / Bottom Clearance of PCB is 25mm
Temperature Control Precision ± 1C
Convryor Speed 20-2000MM/ min
Length of Heating Zones 3650 MM
Temp. Setting Range Rome Temperature ~320C
Conveyor Direction Option

 

Product Introduction of Reflow Oven

Series lead-free reflow oven changdian's mature product after years of market testing.

Series Reflow oven has maintained a larger share of the market for many years.

Its unparalleled heating performance and temperature control system meets the

requirements of various welding processes.
It is changdian's crystallization of years technical research and development. Series

Lead-free reflow is high-end reflow products committed to keeping up with market

demand to enhance customers competitiveness.Its new design concept fully meets

the needs of increasingly diverse processes, And considering the future direction of

the industry, entirely suitable for communications, automotive electronics,

home appliances, computers and other consumer electronic products.

 

What‘s the Reflow Oven

Reflow oven is one of the three main processes in the SMT placement process.

Reflow oven is mainly used for soldering circuit boards with mounted components.

The solder paste is melted by heating to fuse the chip components and the circuit

board pads, and then the solder paste is cooled by reflow oven to cool the components

and The pads are cured together.

 

Photos of Reflow Oven Equipment RF-1010I

RF-1010I Reflow Oven machine

Packing Method : Vaccum package

packing

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company UNIQUE AUTOMATION LIMITED
Location UNIT 408B, LIPPO SUN PLAZA, 28 CANTON ROAD, TSIM SHA TSUI, KOWLOON, HONG KONG.
Contact Person Ivan Zhu

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