8 Zone SMT Reflow Soldering Equipment For PCB Production Line
8 Zone SMT Reflow Soldering Equipment For PCB Production Line
8 Zones Reflow Oven Equipment for SMT Line PCB Production Line
Features of reflow oven
① Simple structure in linear type ,easy in installation and maintation.
② Adopting advanced world famous brand components in pneumatic parts ,electric parts and operation parts.
③ High pressure double crank to control the die opening and closing.
④ Running in a high automatization and intellectualization,no pollution
⑤ Apply a linker to connect with the air conveyor ,which can directly inline with filling machine .
Specifications of reflow oven 8zones
| Modle | RF-H800I |
| Conveyor Type | Chain and Mesh Belt |
| Running / Starting Power (kw) | 8.5 / 33 |
| Heating Zone Length (mm) | 2932 |
| Cooling Type | Forced-air Coooling |
| Control | PLC + PC |
| Temp Range | Room Temperature ~ 320C |
| Temp Accuracy | ± 1C |
| Temp Deviation | ± 2C |
| Machine Dimension (mm) | 5150*1490*1510 |
| Mesh Belt Width ( mm ) | 460 ( or Customized ) |
| Power Supply | 3P/AC 380V OR 3P/AC 220V |
| Cooling Zone length ( mm ) | 600 |
| Parts Height | On Baoard 35mm / Under Board 20mm |
| Conveyor Speed (mm/min ) | 20-1500 |
| Options Available | 450/500 max PCB width Central support for big PCB Extra cooling zone |
| PCB Width (mm) | 50 - 400 ( or customized ) |
| Weight (kg) | Approx.2100 |
Reflow Oven focus on improve equipment enviromental performance, including the high efficiency and energy saving; Air ductstructure,greatly reduce the energy consumption; Lower power consumption get less carbon emissions.Separate temperature and independent wind speed control make the process adjustment range wider, easy to meet all kinds of complex lead-free process.It not only achieves the lead free and welding of high demandand ensure the high quality welding effect. Improved heat transfer technology, avoid the overheating of electronic components on the PCB.
Information of reflow oven
Reflow oven
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic
components to printed circuit boards (PCB).
Types of reflow ovens
- Infrared and convection oven
The oven contains multiple zones, which can be individually controlled for temperature. Generally there are several heating zones followed by one or more cooling zones. The PCB moves through the oven on a conveyor belt, and is therefore subjected to a controlled time-temperature profile.
- Vapour phase oven
The heating of the PCBs is sourced by thermal energy emitted by the phase transition of a heat transfer liquid (e. g. PFPE) condensing on the PCBs. The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed
Detailed picture of reflow oven 8 zones
Photos of reflow oven RF-H800I
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