Lead Free 7 Zone SMT Reflow Oven Equipment Startup Power 30 KW
Lead Free 7 Zone SMT Reflow Oven Equipment Startup Power 30 KW
7 Zone Lead Free Reflow Oven Equipment Machine
The Process of Reflow Oven
The reflow oven process is that when the circuit board with printed solder paste and good components enters the reflow oven furnace, the circuit board is driven by the reflow oven rail transport chain to pass through the preheating zone, heat preservation zone, soldering zone and cooling zone of reflow oven in turn After the temperature changes of the four temperature zones of reflow oven, the reflow oven process of the circuit board is completed. The following specifically explains the soldering change process when the circuit board passes through the four temperature zones of reflow oven in sequence.
Technical Parameter of Reflow Oven
* 15% heat transfer efficiency take time for more
* complex lead-free welding products require
* more large
* From international technology quench system forced aircooling, low temperature cooling, the cooling rate up to
* 3.5-6'C to maintain very convenient.rapid cooling ofthe PCB(option).
* Special rosin recovery system can belong-term to maintain-the cleaniness of the cooling zone.
* The control system uses PLC+industrial PC, high precision,fast response, more stable operation.
* Circulating wind speed is continuously adjustable to сореwith all kinds of welding.
Features of Reflow Oven
1. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency
conversion of the oven can be modified at any moment.
2. Powerful programming software’s controlling system, it can detect the online temperature
of PCB and can analysis save and print the profiles
3. Even temperature and high heat compensation efficiency,especially suitable for soldering
of BGA CSP components.
4. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity,
with auto chain lubricating system.
5. SMEMA compatible
Specifications of Reflow Oven 7 Zones SMT Reflow Oven
| Model | RF-700I |
| Temp. Setting Range | Rome Temperature ~320C |
| No. of Heating Zones | Top 7 & Bottom 7 |
| Length of Heating Zones | 2600 MM |
| No. of Cooling Zones | 1 |
| Temperature Control Precision | ± 1C |
| Temperature Deviation on PCB | ± 1.5C |
| Conveyor Height | 900 ± 20 MM |
| Cooling Method | Air Oven : Forced Air; Nitrogen Oven : Water Chiller |
| Components Clearance | Top / Bottom Clearance of PCB is 25mm |
| Normal Operation Power | About 7KW |
| Dimension ( L*W*H ) | 4650*1300*1450 |
| Convryor Speed | 20-2000MM/min |
| Max. Width of PCB | 50 ~ 400 MM |
| Power Supply | 380V 50HZ / 220V 60HZ |
| Conveyor Direction | Option |
| Mesh Width | 450 MM |
| Startup Power | Approx. 30KW |
| Weight | 1650KG |
| PCB Conveyor Method | Mesh and Rails |
| Nozzle Plate | Stainless Steel Plate |
Product Pictures of Reflow Oven
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