G510LL Lead Free SMT PCB Laser Marking Machine For Assemly Line
G510LL Lead Free SMT PCB Laser Marking Machine For Assemly Line
PCB Laser Marking Machine G510HLL
| Paramters | ||||
| 1 | Model | G510 | G650 | G800 |
| 2 | PCB size | Min 50mm*50mm Max 510mm*460mm |
Min 50mm*50mm Max 650mm*650mm |
Min 50mm*50mm Max 800mm*800mm |
| 3 | PCB Thickness | 0.5mm-10mm | ||
| 4 | Laser Type | CO2/Fiber/Green/UV | ||
| 5 | Marking Speed | 6000mm/s | ||
| 6 | Repeat Positioning Accuracy | ±0.03mm | ||
| 7 | Applicable Product | White ink, green ink, blue ink, black ink | ||
| 8 | Power Supply | 220V/50Hz 2500W | 220V/50Hz 3000W | 220V/50Hz 3500W |
| 9 | One-Dimensional Code | CODE39,CODE25,CODE93,CODE128,EAN-13,ISBN | ||
| 10 | Two-Dimensional Code | Datamatrix,QR Code,micro QR Code,PDF417,Code 49,Code 16K | ||
| 11 | Code size | Min:1.0mm*1.0mm | ||
| 12 | Character Type | True Type,JSF,SHX,DMF | ||
| 13 | Character Height | 0.1 - 0.4mm | ||
| 14 | File format supported | DXF,PLT,EXCE,TXT | ||
| 15 | Automatic positioning function | Support automatic photography | ||
| 16 | Automatic code reading function | Automatically read the QR code and save the data, and automatically record and alarm when the data cannot be read | ||
| 17 | Intelligent production function | It can be customized to connect with ERP/MES/SAP and other systems, and automatically acquire information such as work order number, product batch number, material code name and specification, and automatically code | ||
| 18 | The machine size | 1050x1470x1450mm | 1550x2130x1700mm | 1650x2200x1700mm |
| 19 | The machine weight | 800KG | 1400KG | 1600KG |
| 20 | Operating Environment | 5-40C,35%-80%RH | ||
| 21 | Air Required | 0.5-0.6Mpa | ||
| 22 | Transport Direction | LEFT TO RIGHT RIGHT TO LEFT | ||
| 23 | PCB Clamping | Able to clamp automatically and customize various clamping | ||
| and fixture as needed | ||||
Features of Laser Marking Machine
There are two accepted principles:
(1) "Heat processing" has a laser beam with a higher energy density (it is a concentrated energy flow) that irradiates the surface of the material to be processed. The surface of the material absorbs the laser energy and generates a thermal excitation process in the irradiated area, thereby making the surface of the material (or Coating) temperature rises, causing phenomena such as metamorphosis, melting, ablation, and evaporation.
(2) "Cold working" (ultraviolet) photons with very high load energy can break the chemical bonds in the material (especially organic materials) or the surrounding medium to cause the material to undergo non-thermal process damage. This kind of cold processing is of special significance in laser marking processing, because it is not thermal ablation, but cold peeling that does not produce the side effects of "thermal damage" and breaks chemical bonds, so it has no effect on the inner layer and nearby areas of the processed surface. Produce heating or thermal deformation. For example, in the electronics industry, excimer lasers are used to deposit thin films of chemical substances on base materials and to cut narrow grooves on semiconductor substrates.
Application field
OPTION Internal PCB turnover system
OPTION Special double optical paths design
OPTION Three-sections rail conveyor
OPTION Up&down dual mode laser device
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