Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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ABS Loading Filter Chip Tray 101.6×101.6×7.9mm with 0.3mm Flatness for Semiconductor Packaging

Price Negotiable
Price: $0.3~$0.8(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

This precision chip tray features 0.3mm flatness and is manufactured using ABS material injection molding. Designed for semiconductor and photoelectric industries, it provides superior protection for sensitive electronic components with high cleanliness requirements.

HN21128 Waffle Pack Specifications
Outline Size101.6×101.6×7.9mmBrandHiner-pack
ModelHN21128Package TypeDie
Cavity Size5.2×6.2×2.5mmMatrix Quantity9×9=81 PCS
MaterialABSFlatnessMAX 0.3mm
ColorBlackServiceAccept OEM, ODM
Resistance1.0×10⁴-1.0×10¹¹ΩCertificateROHS SGS
Applications
  • IC Packaging Delivery System
  • Electronic Component Storage
  • Embedded System Components
  • Micro and Nano System Assembly
Available Sizes & Materials
Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS, PC, PPE, etc.1.0×10⁴-1.0×10¹¹ΩOEM, ODMMax 0.2mmCustomizable
3"ABS, PC, PPE, etc.1.0×10⁴-1.0×10¹¹ΩOEM, ODMMax 0.25mmCustomizable
4"ABS, PC, PPE, etc.1.0×10⁴-1.0×10¹¹ΩOEM, ODMMax 0.3mmCustomizable
Custom sizeABS, PC, PPE, etc.1.0×10⁴-1.0×10¹¹ΩOEM, ODMTBCCustomizable
Manufacturing Advantages
  • 10+ years export experience with international customer base
  • Professional engineering team and efficient management
  • Short delivery time with stock availability
  • Small quantity orders accepted
  • 24-hour responsive customer service
  • ISO certified factory with ROHS compliant products
Frequently Asked Questions
Q1: Are You Manufacturer or Trade Company?
We are a 100% manufacturer specializing in packaging solutions for over 10 years, operating from a 1500 square meter workshop in Shenzhen, China.
Q2: What is the material of your product?
Available materials include ABS, PC, PPE, MPPO, PEI, HIPS, and others.
Q3: Can you help with the design?
Yes, we accept customization and can design packaging according to your specific requirements.
Q4: Do you arrange shipment for the products?
Shipment arrangements depend on incoterms. For FOB or CIF pricing, we handle shipment; for EXW pricing, clients arrange their own shipping.
Q5: How about the documents after shipment?
After shipment, we provide all original documents via DHL including Commercial Invoice, Packing List, B/L, and required certificates.
HN21128 Chip Tray with 9x9 matrix design for electronic component storage Close-up view of precision chip tray cavities for semiconductor packaging

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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