Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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8 Inch 200mm Black ESD Wafer Jar with 0.9 Inner Height for Semiconductor Shipping and Storage

Price Negotiable
Price: 3.8~5USD/PCS(According To The QTY And Incoterms)
MOQ: 50PCS
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview
The 8-inch 200mm Black ESD Wafer Jar is engineered for secure storage and transportation of silicon wafers in semiconductor manufacturing. Featuring a 0.9-inch inner height and constructed from conductive PP material, this container provides superior electrostatic discharge protection while maintaining product integrity during handling and shipping.
Key Features & Benefits
  • ESD-safe conductive PP material prevents electrostatic discharge damage
  • Complete protection system includes pink conductive foam cushion, foam liner, and Tyvek paper
  • Optimized for 8-inch diameter wafers with 200mm specifications
  • Lightweight design reduces shipping costs while maintaining durability
  • Suitable for both automated and manual loading/unloading processes
  • Prevents contamination and physical damage during storage and transit
Technical Specifications
Component Diameter Height Material Color Surface Resistance
Wafer Jar (Base+Lid) 8" (230mm) 2" / 3" Conductive PP Black 1.0x10E4~1.0x10E11Ω
Foam Pad 8" 5mm EPE Pink 1.0x10E8~1.0x10E11Ω
Liner 8" 2" / 3" EPE Pink N/A
Tyvek Paper 8" N/A Tyvek White 1.0x10E8~1.0x10E11Ω
Applications
  • Integrated Circuits (IC)
  • Electronic Components
  • Semiconductor Manufacturing
  • Micro and Nano Systems
  • Sensor IC Production
Quality Assurance & Services
  • 100% QC inspection before shipment
  • Compliance with international JEDEC standards
  • Custom design and manufacturing services available
  • Sample stock for product evaluation
  • Technical support and consultation services
  • Competitive pricing with quality assurance
Product Images
8-inch Black ESD Wafer Jar showing complete packaging components including container, foam cushion, and Tyvek paper Close-up view of ESD Wafer Jar construction and material details
Frequently Asked Questions
Are you a manufacturer or trading company?
We are a 100% manufacturer with over 10 years of packaging expertise, operating from a 1500 square meter workshop in Shenzhen, China.
What information is needed for quotation?
Please provide drawings of your IC or component, along with quantity requirements and dimensions.
Do you offer custom design services?
Yes, we accept customization requests and can design packaging solutions according to your specific requirements.
How is quality guaranteed?
All samples undergo rigorous testing, and finished products comply with international JEDEC standards to ensure 100% qualification rate.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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