ROHS PC JEDEC Standard Matrix Tray For IC Device 0.76mm Flatness
ROHS PC JEDEC Matrix Tray For IC Device 0.76mm Flatness
The JEDEC matrix tray is mainly used for chip packaging testing in the semiconductor industry.Because IC chips are tiny and thin, they are extremely vulnerable to damage during storage and transportation. So customers often use the JEDEC tray for packaging protection. It is a standard tray used to transport, store and pack the electronic components. The products not only comply with JEDEC international standards and ROHS environmental protection standards, but also fully meet the packaging requirements of various chips. We can customize the perfect tray according to customers' requirements.
The Details of the HN22009 JEDEC Matrix Tray
The JEDEC trays have the same outline size of 12.7 inches * 5.35 inches (322.6 mm * 135.89 mm),HN22009 is made primarily of PC materials with excellent strength, flame retardant and many other properties. It not only can prevent external damage to customers' products, but also do not pollute the environment.
At the same time, 3*8 matrix pockets are distributed inside the tray. The spacing between the pockets also allows the automation equipment to locate the product more accurately. The tray is not only small in size and light in weight, its warping degree is less than 0.76mm to perfect stacking. Thus it can greatly reduce the customer's transportation and storage costs.
| Outline Line Size | 322.6*135.9*20.23mm | Brand | Hiner-pack |
| Model | HN22009 | Package Type | N/A |
| Cavity Size | 31*21.5*16.2mm | Matrix QTY | 3*8=24PCS |
| Material | PC | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application The HN22009 JEDEC Tray
Electronic Component Test and Measurement Technology
Military Industry Power Supply
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized | ||
Our Service
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans: We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2:What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Ans: Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get quotation of the custom products ?
Ans: Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Ans:Yes, the free sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Ans:Yes, we can put your logo on our products, show us your logo firstly please.
Q7: When can we get the samples?
Ans: We can send you them right now if you are interested in something we have stock, and customize, the project depending on the interested.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.