Custom Cavity Size IC Component Trays For JEDEC Standard Compatibility

Our trays are molded using high-performance polymers that offer excellent dimensional stability under load and heat.

This JEDEC standard matrix tray is purpose-built to streamline operations in semiconductor assembly, inspection, and automated test workflows. The tray’s high mechanical strength and thermal stability make it suitable for repeated industrial use, while its ESD-safe composition provides a reliable safeguard for sensitive electronic components. The precision layout ensures parts remain securely seated during transit or automation, and key orientation indicators allow fast alignment during setup. It is engineered to support a wide variety of component shapes without compromising stackability or system compatibility.

Features & Benefits:

•  Universal Handling Compatibility: Compliant with JEDEC tray standards to ensure seamless integration into industry-wide equipment ecosystems.  

•  Integrated ESD Protection: Conductive material construction neutralizes static buildup, providing safe handling for static-sensitive devices.  

•  Precision-Molded Pockets: Designed to minimize part movement while maintaining consistent positioning throughout automated handling processes.  

•  Automation-Ready Design: Compatible with robotic systems thanks to pickup-friendly surfaces and alignment-friendly geometry. 

•  Durable & Consistent: Maintains shape, flatness, and structural integrity through repetitive loading, handling, and stacking.  

•  Efficient Tray Stacking: Interlocking perimeter features ensure stable vertical stacking without shifting, enhancing transport and storage safety.   

Technical Parameters:

Application:

Used extensively in the electronics manufacturing sector, this tray is ideal for workflows involving IC testing, robotic pick-and-place systems, SMT lines, and component packaging. It supports smooth transfers between workstations and equipment while preventing handling errors and physical damage. Its dimensional accuracy and mechanical reliability make it well-suited for both low- and high-throughput operations, from pilot runs to mass production.

Customization:

To match the varied requirements of different components and assembly environments, customization options include:

•  Pocket Configuration Changes: Modify pocket layouts, shapes, or depths to accommodate specific device geometries or module types.  

•  Color Material Options: Choose from a selection of ESD-safe color compounds for easier process tracking or part differentiation.  

•  In-Tray Labeling: Integrate molded identifiers such as lot numbers, part codes, or other customer-requested details for internal traceability.