This CNC precision machining wafer frame box is specifically designed for plasma cleaning applications in semiconductor manufacturing. Manufactured from SGS-tested 6061 aluminum material, it offers exceptional durability with a service life exceeding 5 years.

This wafer frame box enhances aluminum wire bonding reliability in electronic packaging and improves wire bonding process stability. The design accommodates plasma cleaning machine chamber structures, ensuring optimal positioning and cleaning efficiency for various sample types.

We provide comprehensive semiconductor packaging and transportation solutions, backed by professional certifications and proven successful case studies. Our commitment to quality ensures reliable performance for your wafer handling and storage requirements.