Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities
MOQ: 1000 pcs
Delivery Time: 1~2 Weeks
Brand: Hiner-pack
Product Description

 

 

ESD Black Chip Die BGA QFN Packaging Tray For Optoelectronic Devices Tray

 

 

Antistatic electronic JEDEC trays are special plastic packaging materials that can effectively prevent the generation of static electricity and thus protect electronic products from static damage.

 

JEDEC trays are also a common plastic packaging material used for packaging, transporting and displaying a variety of products, such as IC manufacturing, electronic parts, D-RAM, precision instruments, etc. TRAY are usually designed with a depth that can accommodate multiple products and can be stacked for easy transportation and storage. 

 

 

JEDEC Tray Parameters

 

Shenzhen Hiner Technology Co.,LTD is a professional semiconductor chip packaging factory, dedicated to producing high quality anti-static work tray, JEDEC tray and other plastic packaging materials.

 

Our anti-static work trays and TRAY trays can be customized, including special design or logo. In addition, we also accept OEM manufacturing commissioned by the original manufacturers to meet the needs of different customers. Our products are widely used in different industries such as electronic, medical, industrial, etc., providing customers with high quality packaging solutions.

 

Our anti-static trays are not only of high quality, but also have good cushion packaging and anti-dust effect, which can effectively protect the products from damage and pollution. Our products comply with international environmental requirements and provide customers with green and sustainable packaging solutions.

Mold No. HN23081
Cavity Size/mm 8.3X24.4X2.4
Overall Size/mm 322.6x135.9x7.62
Matrix Quantity 9X9=81PCS
Material MPPO/PEI

 

 

 

Customer FAQ

 

Question 1: Are you a trading company or a manufacturer?
A: We are a manufacturer with 13 years experience in Shenzhen China factory. We are dedicated to integrated services such as molding design, mold manufacturing, injection molding processing, and product shipping;

in addition, we provide semiconductor chip packaging solutions for enterprises and applications. We have technicians with over 20 years of experience and more than 100 employees, as well as a 2,000 square meter factory.

 

Question 2: How do I get a quote?
Answer: We will provide a quote within 24 hours. In order to provide an accurate and immediate quote, please provide the following details:
(1) Documents and drawings.(3D drawings of the product. STP format is best)
(2) Material/temperature resistance/cycle time requirement.
(3) Specification.
(4) Quantity.
(5) Other requirements.

 

Question 3: What if we don't have drawings?
A: We can provide you with a preliminary free design of the product size, when you agree with our offer, you can send us the sample shipping costs borne by us.

Our engineers can provide you with better solutions and product 3D drawings according to your products!

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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