Customizable Bare Die Trays 2-4 Inch with 198 Pockets for Semiconductor Industry Wear Resistance
Hiner-pack's Chip Tray & Waffle Pack series provides secure and convenient packaging solutions for microelectronic components including chips, dies, COG devices, and optoelectronic components. Available in multiple sizes and materials with customizable options to meet specific requirements.
- Permanent antistatic properties compliant with ESD and RoHS environmental standards
- Automation-compatible design for enhanced production efficiency and yield improvement
- Stable dimensions and high precision for crush resistance during transportation
- Dust-free clean packaging suitable for class 10-1000 cleanroom environments
- Custom design capabilities for various styles and sizes to meet unique customer requirements
| Model | HN24059 |
|---|---|
| Available Sizes | 2 inches, 3 inches, 4 inches (customizable) |
| Materials | Antistatic/Conductive ABS, PC |
| Pocket Dimensions | 3.2 × 6.2 × 0.9 mm |
| Matrix Quantity | 11 × 18 = 198 pieces |
| Key Features | Durable, reusable, eco-friendly, biodegradable |
| Accessories | Cover/lid, clip/clamp, Tyvek paper |
| Artwork Format | PDF, 2D, 3D |
We specialize in designing and manufacturing custom trays from scratch with delivery in as little as three weeks. Our precision molds utilize Moldflow analysis for exact control over product dimensions and flatness.
Sample Options:
- Free samples available from existing product lines
- Customized samples designed to your specifications
Our custom packaging trays serve multiple industries including semiconductors, medical components, jewelry, watch parts, and small industrial items. Designed for compatibility with both manual and automated handling systems to ensure reliable performance and reduce shipping and storage costs.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.