Stackable Waffle Pack Bare Die Tray 2-4 Inch Sizes for Microelectronic Chip Packaging with ESD Protection
Hiner-pack's Bare Die Tray series provides secure packaging and transportation solutions for microelectronic components including chips, dies, COG devices, and optoelectronic components. Available in standard 2-inch, 3-inch, and 4-inch sizes with material options of Antistatic/Conductive ABS and PC.
- Permanent antistatic protection compliant with ESD and RoHS environmental standards
- Automation-compatible design for enhanced production yield and efficiency
- Stable dimensions and high precision for secure transport without crushing or damage
- Dust-free cleaning and packaging suitable for cleanrooms from class 10 to 1000
- Custom design capabilities for specific customer requirements
| Model | Material | Color | Matrix Quantity | Pocket Size |
|---|---|---|---|---|
| HN24097 | PC | Black | 5×20=100 pieces | 13×1.35×0.1mm |
Size: Custom length × width × height according to customer requirements
Features: Durable, reusable, eco-friendly, biodegradable
Accessories: Cover/lid, clip/clamp, Tyvek paper
Artwork Format: PDF, 2D, 3D
Fast Delivery: Custom trays delivered within 2 weeks while maintaining high quality standards
Sample Options: Free samples from existing products or customized samples per your design requirements
Our advanced mold design utilizes imported Moldflow analysis to ensure precise control over product size accuracy and flatness. This comprehensive approach integrates material properties, mold structure, and injection molding conditions to meet stringent customer quality standards.
Ideal for semiconductor, microelectronic, medical components, precious gems, springs, screws, watch parts, and any application requiring organized management of small items. Engineered to integrate seamlessly with manual or automated tool handling systems.
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