Product Description:

Bare Die Trays are highly sought-after due to their compact size. They are particularly favored for small die, Chip Scale Packages (CSP), and components of similar sizes where a full-size JEDEC matrix tray would be too big. Despite their smaller footprint, bare die trays provide industry-standard acceptance and effective protection for components.

The stacked design of bare die trays creates protective compartments for parts, making them convenient for packaging and transportation.

Bare die trays are notably popular for manual loading and unloading tasks, with commercial feeders also available. Additionally, we offer custom JEDEC matrix trays that function as adaptors for processing bare die trays in JEDEC tray feeders and handlers.

Features:

• Trays are made of top-quality materials such as conductive plastics and non-conductive polymers, which prevent ESD damage while ensuring durability. This safeguards the bare dies from common ESD hazards in the semiconductor industry. Each mold is custom-made to specific dimensions for different bare die sizes.
• The tray's pocket helps to shape it for a snug fit, creating a secure environment with no movement or potential damage during use.
• Die trays are offered in a wide range of sizes, accommodating small microchip dimensions to large integrated circuits. Tailored tray designs cater to diverse industry needs and innovative requirements.
• Protective casings are crucial for semiconductor manufacturing and assembly processes, providing protection for individual bare dies during transport or storage. They are stackable to optimize space efficiency, allowing for easy storage by stacking the trays securely.

Technical Parameters:

Customization:

When compared to standard bare die trays commonly available in catalogs or from distributors, we specialize in crafting custom bare die trays tailored to the exact dimensions of your parts. These trays are molded from materials selected to meet your specific requirements and can feature custom options including component support features, temperature rating, color choice, engraving, reference marks, fiducials, special sizes, or thickness.