Product Description:

Bare Die Trays are widely used due to their compact size. They are ideal for small die, chip scale packages (CSP), and similar components where a full-size JEDEC matrix tray would be too large. Despite the reduced footprint, bare die trays offer comparable industry acceptance and component protection.

The stackable design of bare die trays creates protective compartments for parts, making them easy to package and transport efficiently. These trays are well-suited for manual loading and unloading tasks, and there are commercial feeders available. In addition, we produce JEDEC matrix trays that can be used as adaptors for processing bare die trays in JEDEC tray feeders and handlers.

Features:

• Trays are constructed of the highest quality materials, such as conductive plastics and non-conductive polymers, preventing ESD damage while maintaining durability. This ensures that the bare dies are protected from ESD hazards common in the semiconductor industry. The mold is customized to specific dimensions for each bare die size.
• The pocket from the tray helps shape it to fit, forming a league with no motion or even damage whilst using the holder.
• Die trays are available for a wide variety of die sizes – from small microchip dimensions to large integrated circuits with respective tray designs able to cater to the many facets and innovative requirements across the industry.
• The protective casings are essential for almost every semiconductor manufacturing and assembly process as they afford protection of the individual bare die while in transport or storage. So they are even stackable to fit more in a smaller space.  Furthermore, it is designed to make them useful in storage and reduce the risk of loss or misplacement.

Technical Parameters:

Customization:

Our custom bare die trays, tailored to the specific needs of your parts, surpass the standard trays commonly found in catalogs or on distributor shelves. These custom trays are molded from materials selected based on your requirements and can feature various custom options such as component support features, temperature ratings, colors, engraving, reference marks and fiducials, as well as special sizes or thicknesses.