Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip

The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack provides a safe and convenient solution for packaging and transporting various microelectronic components such as Chip, Die, COG, and Optoelectronic devices. These products come in multiple sizes and materials, with options including 2-inch and 4-inch product specifications. Materials used include Antistatic/Conductive ABS and PC, offering flexibility for different needs. Additionally, customization is available to meet the specific requirements of customers.

Features:

Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers

This product is manufactured using ESD-safe, non-sloughing, carbon-powder-free, clean polymers. These materials are carefully selected to ensure safety against electrostatic discharge (ESD) while also being environmentally friendly and free of carbon powder residue.

Carbon-fiber reinforced for strength and permanent ESD protection

In addition to its primary materials, this product is reinforced with carbon fiber for enhanced strength and long-lasting ESD protection. The carbon fiber reinforcement ensures durability and reliability in various applications where ESD protection is a critical requirement.

Up to 180°C bake temperature available

This product can withstand bake temperatures of up to 180°C, making it suitable for use in high-temperature environments. The ability to endure such heat levels demonstrates the product's resilience and adaptability for diverse manufacturing processes.

Industry-standard formats, customized for your needs

Available in industry-standard formats, this product can also be customized to meet specific requirements. Whether you need a standard size or a tailored design, the product offers flexibility to accommodate your unique needs and preferences.

Technical Parameters:

Specifications:

The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics:

• External size – 2”, 4”, etc.
• Pocket size or pocket count – choosing one will dictate the other
• Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification:

• Component geometry
• Special process requirements
• Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)