Cleanroom-Safe Tray For Chip Storage And Automated Operations

This high-precision waffle pack chip tray (Bare Die Tray)  is designed in the industry-standard 2x2 inch format, ideal for safely storing and transporting fragile semiconductor die and chip-scale packages (CSP).

Each tray is molded with a uniform pocket matrix tailored to support 2.5D components with minimal surface features. Made of electrically conductive plastic, the tray provides essential electrostatic protection while maintaining rigidity and dimensional stability.

Adaptable to automated production, this waffle pack is an essential component in microelectronic packaging, testing, and inspection workflows.

Features:

 1. Compact 2x2 inch footprint suitable for small die and CSP formats;

 2. Precision-molded conductive polymer ensures ESD protection and part stability;

 3. Customizable pocket shapes and depths to accommodate irregular geometries;

 4. Compatible with standard clip systems, stackable design with top tray cover options;

 5. Durable construction resists warping and maintains alignment under handling stress;

 6. Heat-resistant versions are available for thermal testing or baking environments.

Technical Parameters:

Applications:

Optimized for bare die, chip-scale packages, and small photonic or optical elements , this waffle tray is designed for back-end processes such as inspection, die sorting, packaging, and prototype assembly. Its precision alignment and repeatability make it particularly suitable for R&D labs, engineering lines, and pilot production setups that are moving towards automation.

The waffle tray is ideal for loading operations that require accurate alignment and repeatability  . This makes it a great choice for a variety of tasks, from inspection to die sorting, packaging, and prototype assembly. Its versatility and reliability make it a crucial tool in various settings, such as R&D labs, engineering lines, and pilot production facilities.