Stackable Tray For Microchip Storage In Static-Sensitive Environments

This high-precision waffle pack chip tray (Bare Die Tray) is designed in the industry-standard 2x2 inch format, ideal for safely storing and transporting fragile semiconductor die and chip-scale packages (CSPs).

Each tray is molded with a uniform pocket matrix tailored to support 2.5D components with minimal surface features. Made of electrically conductive plastic, the tray provides essential electrostatic protection while maintaining rigidity and dimensional stability.

Adaptable to automated production, this waffle pack is an essential component in microelectronic packaging, testing, and inspection workflows.

Features:

1. The design features a compact 2x2 inch footprint that is suitable for small die and CSP formats.

2. It incorporates precision-molded conductive polymer to ensure effective ESD protection and maintain part stability.

3. Customizable pocket shapes and depths are available to accommodate irregular geometries as needed.

4. The holder is compatible with standard clip systems and offers a stackable design with top tray cover options.

5. Its durable construction is designed to resist warping and maintain alignment even under handling stress.

6. Heat-resistant versions of the holder are also available for use in thermal testing or baking environments.

Technical Parameters:

Applications:

Optimized for use with bare die, chip-scale packages, and small photonic or optical elements, this waffle tray is well-suited for back-end processes including inspection, die sorting, packaging, and prototype assembly.

It supports tray loading operations where precise alignment and repeatability are critical, making it ideal for R&D labs, engineering lines, and pilot production setups transitioning toward automation.