Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies

This meticulously crafted waffle pack chip tray features a high level of precision and is structured according to the widely-accepted 2x2 inch standard dimensions. It is specifically designed to securely house and move delicate semiconductor dies and chip-scale packages (CSPs) without risking damage. Each individual tray is crafted with a consistent grid of pockets customized to cradle 2.5D elements with minimal surface irregularities.

Constructed from electrically conductive plastic, this tray offers crucial protection against electrostatic discharge while also retaining the needed stiffness and dimensional steadiness. Its adaptability for integration into automated manufacturing processes makes it a vital element within the realms of microelectronic packaging, testing, and examination procedures.

Features:

 1. Compact 2x2 inch footprint suitable for small die and CSP formats;

 2. Precision-molded conductive polymer ensures ESD protection and part stability;

 3. Customizable pocket shapes and depths to accommodate irregular geometries;

 4. Compatible with standard clip systems, stackable design with top tray cover options;

 5. Durable construction resists warping and maintains alignment under handling stress;

 6. Heat-resistant versions are available for thermal testing or baking environments.

Technical Parameters:

Applications:

Optimized for the use of bare die, chip-scale packages, and small photonic or optical elements, this waffle tray is specifically designed for back-end processes. These processes commonly include inspection, die sorting, packaging, and prototype assembly. The tray is engineered to facilitate tray loading operations, where precise alignment and repeatability play crucial roles. As a result, it is highly suitable for environments such as R&D labs, engineering lines, and pilot production setups that are moving towards automation.