Permanent Antistatic 2 Inch Waffle Pack Chip Trays For R&D Prototyping And Batch Assembly
Price:
TBC
MOQ:
500
Delivery Time:
1~2 Weeks
Brand:
Hiner-pack
Product Description
Permanent Antistatic 2 Inch Waffle Pack Chip Trays For R&D Prototyping And Batch Assembly
Waffle pack is positioned as a cost-effective, high-utility carrier ideal for research and development laboratories, engineering lines, and batch prototype assembly where initial costs and rapid deployment are prioritized. While maintaining the high quality and precision required for microelectronics, this tray focuses on the widely accepted 2×2 inch format, which is convenient for small, sensitive parts. It is constructed from a high-quality, permanent antistatic ABS material. This material provides essential ESD protection required for safely handling bare die and chip-scale packages (CSPs) without the higher cost associated with specialized bakeable or carbon-fiber reinforced materials, making it an excellent entry-point solution.
Key Features/ Benefits
-
Permanent Antistatic ABS Material
-
Ideal 2×2 Inch Compact Size
- Rapid Turnaround Customization
- Stackable and Secure Handling
- Precision Molding for Alignment
Specifications
| Brand | Hiner-pack | ||
| Material | ABS | ||
| Color | Black | ||
| Outline Line Size | 50.7x50.7x4mm | ||
| Matrix QTY | 6x8=48PCS | ||
| Service | Accept OEM, ODM | ||
Applications
This waffle pack is primarily applied in the initial stages of the component lifecycle and in lower-volume processes. It is the perfect fit for: R&D Laboratory Use, providing a safe and organized way to manage and test small quantities of new semiconductor or optical designs; Prototype Assembly and Engineering Runs, enabling quick, safe handling of limited component batches before full production scaling; Manual Die Sorting and Inspection, where the tray's compact size and stable pockets facilitate easy manual manipulation and visual quality checks; and Internal Component Transfer, providing a low-cost, secure carrier for moving components between different workstations within a facility. Because many existing processes already utilize the waffle pack format, this tray offers an easy, low-risk entry point for new components moving into established workflows, making the transition seamless and budget-friendly.
Customization
Customization for the R&D focused tray emphasizes functionality and minimum non-recurring expenses (NRE). While the standard material is Antistatic ABS, we offer customization of: Specific Pocket Geometries tailored to protect critical features like terminal pads or lenses on prototype components; Color Coding using different antistatic resins to visually distinguish various component revisions or test lots; and Simplified Mold Designs optimized to reduce the NRE charge for entirely new custom geometries. We are also able to integrate basic alignment features like clearance cuts or tapered walls to accommodate early-stage, semi-automated pick-and-place trials. Our expertise allows us to provide custom-sized pockets and specific features without over-engineering the solution, keeping the focus on speed and cost-effectiveness for low-volume requirements.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu