Permanently Conductive RoHS Compliant Waffle Pack Chip Trays For Long Term Storage
Price:
TBC
MOQ:
500
Delivery Time:
1~2 Weeks
Brand:
Hiner-pack
Product Description
Permanently Conductive RoHS Compliant Waffle Pack Chip Trays For Long Term Storage
In the semiconductor industry, the long-term reliability of a component is often dictated by the stability of its packaging material. This series of Permanently Conductive Waffle Pack Chip Trays is engineered with a focus on material science to provide a safe and stable environment for sensitive microelectronics.
Unlike standard plastic trays that may lose their antistatic properties over time, our waffle packs are molded from carbon-fiber reinforced polymers or specialized conductive ABS/PC resins. This ensures that the electrostatic discharge (ESD) protection is an inherent part of the material structure, not just a surface treatment. The result is a tray that meets both ESD and RoHS environmental standards permanently. These traditional "waffle" format trays, typically 2 or 4 inches square, feature a regular pattern of separator ribs that create secure pockets for bare die, chip-scale packages (CSP), and flat 2.5D components.
Unlike standard plastic trays that may lose their antistatic properties over time, our waffle packs are molded from carbon-fiber reinforced polymers or specialized conductive ABS/PC resins. This ensures that the electrostatic discharge (ESD) protection is an inherent part of the material structure, not just a surface treatment. The result is a tray that meets both ESD and RoHS environmental standards permanently. These traditional "waffle" format trays, typically 2 or 4 inches square, feature a regular pattern of separator ribs that create secure pockets for bare die, chip-scale packages (CSP), and flat 2.5D components.
Key Features/ Benefits
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Permanent ESD Protection
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Exceptional Dimensional Stability
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RoHS and Environmental Compliance
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Cleanroom Ready (Class 100-1000)
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High Precision Flatness
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Versatile Sizing and Material Grades
Specifications
| Brand | Hiner-pack | ||
| Material | ABS | ||
| Color | Black | ||
| Outline Line Size | 50.7x50.7x4mm | ||
| Matrix QTY | 16X16=250PCS | ||
| Service | Accept OEM, ODM | ||
Applications
These custom-engineered waffle packs are the ideal solution for non-standard microelectronic assembly and specialized component handling. Their primary applications include: Prototype Assembly of New Sensors, where the pocket must match a unique physical profile; Handling of Fragile Medical Micro-Parts, such as surgical implants or diagnostic sensors; and Secure Transport of Specialized Gems or Watch Components, where high-value items require individual, anti-crush compartments. They are also widely utilized in Engineering Lines transitioning to Automation, providing a consistent interface for custom tools. Because they adhere to the unofficial industry-standard 2-inch or 4-inch footprint, they remain compatible with existing waffle pack accessories like covers and clips while offering a completely bespoke internal environment.
Customization
We provide a comprehensive "design-from-scratch" service to meet your most challenging packaging needs. Customization options extend to Component Support Features, such as pedestals that lift the part to protect bottom-side features, or Reference Marks and Fiducials molded directly into the tray to aid machine vision systems. You can specify the Material Type (Conductive ABS, PC, or high-temp resins), Color-Coding for lot identification, and even Engraving for part numbers. Whether your part requires terminal isolation or specialized pad protection, our team can optimize the pocket geometry to ensure 100% alignment. For low-volume needs, we also offer CNC machining or 3D printing options, though molded trays remain the gold standard for high-precision, ESD-safe mass production.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu