2 Inch Waffle Pack Chip Trays For Accurate Microelectronic Component Alignment
Price:
TBC
MOQ:
500
Delivery Time:
1~2 Weeks
Brand:
Hiner-pack
Product Description
2 Inch Waffle Pack Chip Trays For Accurate Microelectronic Component Alignment
The High Precision Waffle Pack Chip Tray series is the cornerstone of reliable microelectronic component management, specifically designed for applications where dimensional accuracy is non-negotiable. While many generic carriers suffer from microscopic warping, our 2-inch format trays are engineered to maintain an absolute planar degree throughout their operational lifecycle.
The secret to this stability lies in our advanced manufacturing workflow, which begins with comprehensive Moldflow analysis. By simulating the injection molding process before the first tool is ever cut, our engineers can precisely predict and mitigate potential shrinkage or stress points. This data-driven approach ensures that the uniform pocket matrix remains perfectly aligned with the tray’s external dimensions, creating a predictable interface for both manual inspection and automated handling systems.
Constructed from electrically conductive ABS or PC resins, these waffle packs provide the essential electrostatic discharge (ESD) protection required for sensitive bare die and chip-scale packages (CSPs). The tray's design features a regular pattern of separator ribs that define each pocket, ensuring that even the most fragile 2.5D components are cradled in a secure, movement-free environment. For standard workflows, these trays offer a cost-effective, high-precision solution that adheres to the unofficial industry standards for small-format microelectronics.
The secret to this stability lies in our advanced manufacturing workflow, which begins with comprehensive Moldflow analysis. By simulating the injection molding process before the first tool is ever cut, our engineers can precisely predict and mitigate potential shrinkage or stress points. This data-driven approach ensures that the uniform pocket matrix remains perfectly aligned with the tray’s external dimensions, creating a predictable interface for both manual inspection and automated handling systems.
Constructed from electrically conductive ABS or PC resins, these waffle packs provide the essential electrostatic discharge (ESD) protection required for sensitive bare die and chip-scale packages (CSPs). The tray's design features a regular pattern of separator ribs that define each pocket, ensuring that even the most fragile 2.5D components are cradled in a secure, movement-free environment. For standard workflows, these trays offer a cost-effective, high-precision solution that adheres to the unofficial industry standards for small-format microelectronics.
Key Features/ Benefits
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Advanced Moldflow Optimization
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Superior Dimensional Tolerance
-
Permanent ESD Protection
-
Material Selection for Stability
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Industry-Standard 2×2 Inch Footprint
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Stackable Security
Specifications
| Brand | Hiner-pack | ||
| Material | ABS | ||
| Color | Black | ||
| Outline Line Size | 50.7x50.7x4mm | ||
| Matrix QTY | 13X20-10=250PCS | ||
| Service | Accept OEM, ODM | ||
Applications
These high-precision carriers are optimized for Back-End Semiconductor Processes where alignment is a primary concern. Key applications include: High-Speed Die Sorting, where the tray’s flatness prevents machine "miss-picks"; Manual and Automated Inspection, providing a stable focal plane for optical equipment; and Kitting for Prototype Assembly, where small quantities of diverse die must be organized and protected. Because of their stable size and reliable protection, they are also widely adopted in Aerospace and Defense microelectronics, where component traceability and physical security are paramount. Whether handled manually in an R&D lab or fed into an automated assembly line, these waffle packs ensure your components remain exactly where they belong.
Customization
We provide deep customization capabilities to adapt our trays to your specific process constraints. Our engineering team can optimize Pocket Geometry, including adding tapered walls or specialized corner relief cuts to accommodate specific component features like solder balls or sensitive pads. While standard trays are for ambient use, we can discuss Material Upgrades based on your environmental needs, choosing between various conductive resins or specialized colors for lot tracking. Customization also extends to the inclusion of Reference Marks or Fiducials molded directly into the tray frame to improve the speed and reliability of automated alignment tools.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu