Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Precision Jedec Ic Trays For Advanced Semiconductor Packaging And Complex Ic Modules
Looking for reliable precision JEDEC IC trays for advanced semiconductor packaging? These high-quality JEDEC IC trays are specially made for complex IC module packaging applications.
These custom JEDEC trays feature finely processed high-precision cavities that fit complex IC structures very well. They meet standard JEDEC industry requirements and can be fully customized according to your chip design drawings.
They are widely compatible with modern semiconductor packaging processes, and perfectly meet the packaging needs of SiP modules, MEMS devices and various complex IC modules.
Key Features/ Benefits
- Full customization based on chip drawing
- High precision cavity for complex IC structures
- Excellent anti-static performance
- Fast mold development
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.62 mm | ||
| Matrix QTY | 14x35=490 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
This MPPO high-temperature resistant JEDEC IC tray provides full protection for IC chips throughout production, testing, packaging and transportation processes. It features excellent ESD anti-static performance, making it extremely suitable for electrostatic-sensitive semiconductor devices.It is widely applied to these professional semiconductor scenarios:
- High-temperature SiP system-in-package packaging processes
- Precision MEMS micro-electro-mechanical device packaging & handling
- Advanced high-density semiconductor module assembly
- Fine Pitch IC chip packaging, testing and carrier storage
- High temperature resistant semiconductor manufacturing workshops
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Professional engineering team
- Stable supply for global semiconductor customers
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu