ESD Anti-Static Waffle Pack Tray for IC Chips with High Temperature Resistance and Customizable Cavity Sizes
This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.
It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.
It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.
- Deliver effective ESD anti-static performance
- Withstands 125℃ high temperatures.
- Offers secure IC chip storage.
- Protects delicate fine pitch IC components efficiently
- Support fully customized cavity sizes and layout designs
- The factory has ISO certification, and the products comply with the RoHS standard.
| Brand | Hiner-pack | ||
| Color | Black | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 17x18=306 PCS | ||
| Service | Accept OEM, ODM | ||
It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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