Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging
Shield delicate semiconductor components from dust and damage during packaging operations. Minimize contamination risks effectively. Built with durable structure to meet JEDEC standards for reliable industrial use. Seeking trusted tray solutions for secure semiconductor packaging?
Fit automated packaging lines and cleanroom environments perfectly. Perform steadily in component handling and packaging procedures. Adapt to diverse semiconductor packaging processes smoothly.
Enable safe component storage and logistics. Support custom designs to meet specific packaging demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits
- Deliver durable construction.
- Reduce dust contamination.
- Dust minimization.
- Component protection.
- Flexible customization.
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6x135.9x7.62 mm | ||
| Matrix QTY | 4x9=36 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.
Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.
Packaging & Shipping/ Services
Offer targeted customization for JEDEC IC trays tailored to packaging and transportation needs. Collaborate closely with teams to design cavity shapes, anti-slip structures, and shock-absorbent materials for secure component handling during packaging and long-distance logistics. Develop anti-static or dust-sealed variants, and validate prototypes through vibration and drop tests. Deliver personalized tray solutions that safeguard semiconductor components throughout packaging, loading, and inter-factory or global shipment processes.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu