Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
Durable JEDEC IC Trays Protect Semiconductors and Reduce Dust in Packaging
Offer robust structural integrity to prevent IC shifting, scratches, and contamination. Built with heat-resistant MPPO material to withstand up to 150°C for stable industrial performance. Meet JEDEC standards for consistent reliability. Seeking durable trays for secure IC handling?
Integrate seamlessly with automated packaging lines and logistics workflows. Perform steadily in loading, transfer, and high-temperature processing procedures. Adapt smoothly to diverse semiconductor packaging and shipping scenarios.
Support fully customized cavity sizes and grid layouts to match specific IC dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.
Key Features/ Benefits
- Deliver durable construction.
- Reduce dust contamination.
- Support small batch production in the first batch.
- More than 12 years of export experience.
- With professional engineers and efficient management.
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×8.12 mm | ||
| Matrix QTY | 2X36=72 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Serve semiconductor IC packaging, high-temperature assembly, cleanroom processing, and component storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.
Also utilized in inter-factory IC transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.
Packaging & Shipping/ Services
Provide tailored solutions for IC packaging and transportation. Adjust cavity size, pitch, and layout to fit diverse IC dimensions for secure loading and transit. Leverage heat-resistant MPPO material to withstand 150°C processes. Ensure stable performance during long-distance shipping and automated packaging operations.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu