JEDEC IC Trays for Dust Protection & Production Safety
Price:
$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
MOQ:
500 pcs
Delivery Time:
10 workdays
Brand:
Hiner-pack
Product Description
JEDEC IC Trays for Dust Protection & Production Safety
Shield delicate IC components from impact, dust, and misalignment during production. Built with heat-resistant MPPO material for long-lasting structural stability. Adhere to JEDEC standards for consistent industrial performance. Seeking reliable trays to keep components intact?
Integrate seamlessly with automated assembly lines and cleanroom workflows. Perform steadily in component loading, transfer, and packaging procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.
Support fully customized cavity shapes and grid layouts to match specific component dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize manufacturing efficiency and protect ICs throughout transit.
Key Features/ Benefits
- Sturdy structural integrity
- Effective dust prevention
- Short delivery time and good quality.
- Professional sales within 24 hours efficient reply.
- The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Black | ||
| Outline Line Size | 322.6×135.9×7.5 mm | ||
| Matrix QTY | 4X2=8 PCS | ||
| Service | Accept OEM, ODM | ||
Applications
Serve semiconductor IC assembly, cleanroom testing, component sorting, and precision storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.
Also utilized in inter-factory component transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.
Customized Services
Provide fully customized solutions for JEDEC IC trays. Adjust cavity size, pitch, and layout to fit diverse component dimensions.
Leverage durable MPPO material for enhanced stability. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.
Why Choose Us:
- Rich experience in JEDEC / IC / waffle pack trays
- In-house mold design capability
- Fast prototype development
- Strict QC process
- Stable supply for global semiconductor customers
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu