JEDEC IC Trays ESD Durable PPE SGS Approved - 125°C to 150°C Bake Temperature with 10⁴-10¹¹Ω Surface Resistance
Professional JEDEC standard IC trays designed for safe transportation and handling of semiconductor components. These ESD-protective trays offer maximum protection for sensitive integrated circuits while supporting automated manufacturing processes.
JEDEC trays are increasingly essential in the semiconductor industry for carrying IC chips with various packaging methods and modules of different sizes. They provide convenient and secure transportation for high-precision components while ensuring protection against electrostatic discharge.
- Compliant with JEDEC international standards for strong industry compatibility
- Optimized design provides comprehensive IC protection while reducing transportation costs
- V-type tray design offers enhanced protection for IC substrate edge ball placement
- Multiple material options available to meet specific ESD and process requirements
- Support for non-standard format customization based on customer specifications
- Compatible with BGA, QFN, QFP, PGA, TQFP, LQFP, SoC, SiP and all packaging methods
| Material | Bake Temperature | Surface Resistance |
|---|---|---|
| PPE | 125°C - 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| MPPO + Carbon Fiber | 125°C - 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| MPPO + Carbon Powder | 125°C - 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| MPPO + Glass Fiber | 125°C - 150°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| PEI + Carbon Fiber | Up to 180°C | 1.0×10⁴Ω - 1.0×10¹¹Ω |
| IDP Color | 85°C | 1.0×10⁶Ω - 1.0×10¹⁰Ω |
Custom color, temperature, and other special requirements available upon request.
The flat cells in the center area of each tray are specifically designed for automated equipment, allowing the use of vacuum pickup tools. The 45-degree chamfer provides visual indication of Pin 1 orientation and prevents stacking errors, minimizing operator mistakes while maximizing chip protection.
Please provide detailed requirements for immediate pricing. Contact us via Skype, Email, Phone, or WhatsApp for purchasing discussions.
We respond within 24 hours during business days.
We offer IC tray design services based on your component specifications, providing comprehensive support from design to packaging and shipping.
We accept EXW, FOB, CIF, DDU, DDP and other terms for your convenience and cost-effectiveness.
Our samples undergo rigorous testing, and finished products comply with international JEDEC standards to ensure 100% qualification rate.
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