Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
Menu
Packaging & Printing Other Packaging & Printing Products

DRAM IC ESD Component Tray 322.6x135.9mm JEDEC Standard for BGA QFN QFP Packaging

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
DRAM IC ESD Component Tray for Electronics Parts Packaging

Enhance automation efficiency and component protection with JEDEC-compliant trays engineered specifically for your electronic components.

Key Features
  • JEDEC international standard compliance with strong versatility
  • Optimal design provides comprehensive IC protection while reducing transportation costs
  • Multiple material options to meet specific ESD and process requirements
  • Support for non-standard format customization services
  • Compatible with BGA, QFN, QFP, PGA, TQFP, LQFP, SoC, SiP and all packaging methods
  • Structural design meets automatic feeding system requirements for modernized loading
Applications

Package IC, PCBA module components, electronic component packaging, optical device packaging

Technical Specifications
Parameter Value
Brand Hiner-pack
Model HN1876
Outline Dimensions 322.6 × 135.9 × 7.62 mm
Cavity Size 2.9 × 4.1 × 2.7 mm
Package Type IC
Material PC (Polycarbonate)
Surface Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Color Yellow
Flatness MAX 0.76 mm
Certification RoHS Compliant
Service OEM & ODM Accepted
Material Options & Baking Temperatures
Material Bake Temperature Surface Resistance
PPE 125°C - Max 150°C 1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Carbon Fiber 125°C - Max 150°C 1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Carbon Powder 125°C - Max 150°C 1.0×10⁴ - 1.0×10¹¹ Ω
MPPO + Glass Fiber 125°C - Max 150°C 1.0×10⁴ - 1.0×10¹¹ Ω
PEI + Carbon Fiber Max 180°C 1.0×10⁴ - 1.0×10¹¹ Ω
IDP Color 85°C 1.0×10⁶ - 1.0×10¹⁰ Ω

Custom color, temperature, and other special requirements available upon request.

Yellow JEDEC tray IC chip tray HN1876 model for electronic component packaging
Frequently Asked Questions
How can I get a quotation?

Please provide detailed requirements for immediate pricing. Contact us via Skype, Email, Phone, or WhatsApp for prompt response.

How long will it take to get a response?

We respond within 24 hours during working days.

What kind of service do we provide?

We offer complete IC tray design services based on your component specifications, providing one-stop solutions from design to shipping.

What are your delivery terms?

We accept EXW, FOB, CIF, DDU, DDP - choose the most convenient option for you.

How to guarantee quality?

All samples undergo rigorous testing, and finished products comply with JEDEC international standards to ensure 100% qualification rate.

Yellow JEDEC tray HN1876-2 showing detailed cavity structure for IC components

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

Request A Quote

Please check your email address.
Your message must be at least 20 characters.