High Temperature Resistance JEDEC IC Trays - 125-150°C Bake Temperature, 322.6×135.9mm Dimensions, RoHS Certified
Built to specification and engineered for durability, our JEDEC trays are customized for your IC's geometry, height, and handling requirements.
JEDEC trays must withstand high temperatures of 125-150°C. Black materials provide optimal anti-static properties and thermal stability, making them the preferred choice for high-temperature applications. Alternative colors may not meet the same performance standards for electrostatic discharge protection and heat resistance.
- Superior performance protection for sensitive IC chips
- Compatibility with automated equipment requiring high-temperature processing
- Recyclable plastic construction for environmental sustainability
- Reduced transportation costs through reusable design
- Maximum utilization of raw materials value
| Parameter | Value |
|---|---|
| Brand | Hiner-pack |
| Model | HN1940 |
| Outline Dimensions | 322.6 × 135.9 × 8.65mm |
| Cavity Size | 34 × 21 × 4mm |
| Material | PC (Polycarbonate) |
| Surface Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Color | Black (standard) |
| Flatness | Maximum 0.76mm |
| Package Type | PCBA |
| Certification | RoHS Compliant |
| Customization | Available for size and specifications |
| Services | OEM and ODM accepted |
| Material Type | Bake Temperature Range | Surface Resistance |
|---|---|---|
| PPE | 125°C - Maximum 150°C | 1.0×10⁴ - 1.0×10¹¹ Ω |
| MPPO + Carbon Fiber | 125°C - Maximum 150°C | 1.0×10⁴ - 1.0×10¹¹ Ω |
| MPPO + Carbon Powder | 125°C - Maximum 150°C | 1.0×10⁴ - 1.0×10¹¹ Ω |
| MPPO + Glass Fiber | 125°C - Maximum 150°C | 1.0×10⁴ - 1.0×10¹¹ Ω |
| PEI + Carbon Fiber | Maximum 180°C | 1.0×10⁴ - 1.0×10¹¹ Ω |
| IDP Color | 85°C | 1.0×10⁶ - 1.0×10¹⁰ Ω |
Custom color, temperature, and other special requirements available upon request.
Please provide detailed requirements for immediate pricing. Contact us via Skype, Email, Phone, or WhatsApp for purchasing discussions.
We respond within 24 hours during business days.
We offer IC tray design based on your component specifications, providing comprehensive service from design to packaging and shipping.
We accept EXW, FOB, CIF, DDU, DDP, and other delivery terms for your convenience.
All samples undergo rigorous testing to ensure 100% compliance with international JEDEC standards.
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