Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
Verified Supplier
13 Years
Since 2013
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Customized Waffle Micro Electronic Component Tray 2-4 Inch ESD Protection 0.2-0.3mm Flatness

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Customized Waffle Micro Electronic Component Trays
Structurally standard ESD PC waffle packs designed for micro electronic components with customizable requirements to meet specific packaging needs.
Advanced Packaging Solutions
Waffle packs provide superior packaging for die, die attach preforms, and bond pads. As component sizes continue to shrink, waffle packaging becomes increasingly essential for modern electronics manufacturing.
Key Advantages
  • Automated loading capability for parts as small as 0.0005 inches
  • Superior protection compared to taping methods
  • Ideal for optical applications and sensitive components
  • Comprehensive transit protection with convenient handling
  • Perfect for silicon dies from MPW processes
Product Applications
  • Wafer Die / Bar / Chips packaging
  • PCBA module component protection
  • Electronic component packaging
  • Optical device packaging
Technical Specifications
Outline Size Material Surface Resistance Service Flatness Color
2" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.2mm Customizable
3" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.25mm Customizable
4" ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM Max 0.3mm Customizable
Custom size ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω OEM, ODM TBC Customizable
Additional Specifications
Parameter Details
Cavity Size Customized Size
Item Material ABS / PC / MPPO / PPE (customizable)
OEM & ODM YES
Item Color Customizable
Features Durable; Reusable; Eco-friendly; Biodegradable
MOQ 500 pieces
Delivery Time 8-10 working days (depending on quantity)
Professional Design & Packaging Services
We provide comprehensive one-stop service from design to production to final packaging, ensuring optimal protection for your electronic components.
Customized waffle electronic component tray with multiple cavities for micro parts ESD protective waffle pack tray for semiconductor components
Frequently Asked Questions
Can you do OEM and customized design IC tray?
We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
How long is your delivery time?
Typically 5-8 working days, depending on the actual purchase quantity of orders.
Do you provide samples? Is it free or extra?
Yes, we offer samples which may be free or charged according to product value, with shipping costs normally collected or as agreed.
What kind of Incoterm can you support?
We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP and other incoterms as agreed.
What shipping methods do you offer?
By sea, by air, or by express, depending on customer order quantity and volume.
Industrial waffle pack tray manufacturing and quality control process

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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