ESD ABS Waffle Pack Trays 2-4 Inch Custom Sizes with 10⁴-10¹¹Ω Surface Resistance for Electronic Components
Price:
$0.35~$0.85(Prices are determined according to different incoterms and quantities）
MOQ:
1000 pcs
Delivery Time:
5~8 working days
Brand:
Hiner-pack
Product Description
ESD ABS Waffle Pack Trays for Electronic Components
Our anti-static waffle pack trays provide comprehensive protection for electronic parts during transit, transport, and storage. Manufactured using high-temperature resistant plastics through injection molding, these trays feature permanent electrostatic dissipation properties and excellent mechanical strength.
Key Product Features
- Compact design with light weight for reduced transportation costs
- High capacity for multiple chips, ideal for transfer operations and testing samples
- Stable anti-static performance with surface resistance of 10⁴-10¹¹Ω
- Excellent flatness (max 0.3mm) for automated equipment compatibility
- Compatible with matching covers and clips for various shipping methods
- Recyclable plastic material with environmental-friendly degradation
- Stackable design with optimized matrix utilization
Technical Specifications
| Outline Size | Material | Surface Resistance | Flatness | Color |
|---|---|---|---|---|
| 2" | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | Max 0.2mm | Customizable |
| 3" | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | Max 0.25mm | Customizable |
| 4" | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | Max 0.3mm | Customizable |
| Custom sizes | ABS, PC, PPE, etc. | 1.0×10⁴-1.0×10¹¹Ω | To be confirmed | Customizable |
Standard Product Details
| Outline Size | 101.57×101.57×3mm |
| Model | HN21012-2 |
| Cavity Size | 8.5×8.5mm |
| Matrix Quantity | 15×15=225 pieces |
| Material | ABS |
| Flatness | Max 0.3mm |
| Color | Black |
| Surface Resistance | 1.0×10⁴-1.0×10¹¹Ω |
| Certification | RoHS Compliant |
Applications
• Wafer Die / Bar / Chips
• PCBA Module Components
• Electronic Component Packaging
• Optical Device Packaging
• PCBA Module Components
• Electronic Component Packaging
• Optical Device Packaging
Manufacturing Advantages
- Over 10 years of export experience with ISO certification
- Professional engineering team and efficient management
- Short delivery times with consistent quality
- Support for small batch production runs
- 24-hour professional sales support
- RoHS compliant products exported worldwide
Frequently Asked Questions
Can you do OEM and customized design IC tray?
We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
How long is your delivery time?
Typically 5-8 working days, depending on actual order quantity.
Do you provide samples? Is it free or extra?
Yes, we offer samples which may be free or charged based on product value, with shipping costs typically collected or as agreed.
What kind of Incoterm can you support?
We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP and other incoterms as agreed.
What shipping methods do you offer?
Sea freight, air freight, express delivery, or postal service based on customer order quantity and volume.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hiner Technology Co., Ltd.
Location
Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person
Zhu