Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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QFP Package ESD IC Trays 322.6x135.9mm with 0.76mm Flatness and JEDEC Standard Compliance

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

Specialized ESD IC trays designed for QFP package integrated circuits, featuring JEDEC standard compliance and maximum 0.76mm flatness. These anti-static trays provide superior protection for sensitive IC components during storage, handling, and automated processing.

Key Features & Design
  • Dual-side groove design protects QFP package pins from damage
  • Center card slot ensures secure chip fixation and automated handling
  • JEDEC standard compliance for international quality assurance
  • Maximum 0.76mm flatness for precision component placement
  • Anti-static PPE material with surface resistance of 10⁴-10¹¹Ω
  • Customizable designs for various IC packaging types
Technical Specifications
Parameter Value
Outline Dimensions 322.6 × 135.9 × 12.19mm
Cavity Size 22 × 22 × 6.9mm
Matrix Quantity 11 × 4 = 44 pieces
Material PPE (Anti-static)
Flatness Maximum 0.76mm
Surface Resistance 1.0×10⁴ - 1.0×10¹¹Ω
Color Black (Customizable)
Certification ROHS Compliant
Material Temperature Resistance
Material Bake Temperature Surface Resistance
PPE 125°C - 150°C 1.0×10⁴ - 1.0×10¹¹Ω
MPPO + Carbon Fiber 125°C - 150°C 1.0×10⁴ - 1.0×10¹¹Ω
MPPO + Carbon Powder 125°C - 150°C 1.0×10⁴ - 1.0×10¹¹Ω
MPPO + Glass Fiber 125°C - 150°C 1.0×10⁴ - 1.0×10¹¹Ω
PEI + Carbon Fiber 180°C 1.0×10⁴ - 1.0×10¹¹Ω
IDP Color 85°C 1.0×10⁶ - 1.0×10¹⁰Ω
Applications
  • Integrated Circuit Packaging
  • PCBA Module Component Storage
  • Electronic Component Packaging
  • Optical Device Packaging
Customization Services

We provide comprehensive custom IC tray solutions for various packaging types including BGA, FBGA, LGA, QFN, QFP, PGA, TQFP, LQFP, SoC, and SiP. Our design-to-shipping service ensures optimal protection for your specific chip requirements.

QFP IC Tray design showing pin protection grooves and center card slot Close-up view of QFP IC tray with integrated circuit placement

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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