Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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Machinery Cleaning Equipment Industrial Ultrasonic Cleaner

Custom Black ESD JEDEC IC Trays 322.6x135.9mm for PCBA Module Ultrasonic Cleaning

Price Negotiable
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

Customized black ESD JEDEC IC trays designed specifically for ultrasonic cleaning applications in PCBA module handling. Precision-molded cavities ensure perfect fit for chips and modules, reducing movement and contamination during transportation and processing.

Key Features
  • Standard JEDEC tray outline dimensions: 322.6 × 135.9 × 7.62 mm or 322.6 × 135.9 × 12.19 mm
  • Injection-molded production process for consistent quality
  • ESD protection with surface resistance range: 1.0×10⁴Ω to 1.0×10¹¹Ω
  • Available in black color with RoHS certification
  • Matrix capacity: 3×7 configuration for 21 pieces
  • Maximum flatness tolerance: 0.76 mm
Technical Specifications
Parameter Specification
Brand Hiner-pack
Model HN 18102
Outline Size 322.6 × 135.9 × 7.62 mm
Cavity Size 35 × 35 × 3.05 mm
Package Type PCBA
Material PPE
Matrix Quantity 3 × 7 = 21 pieces
Flatness Maximum 0.76 mm
Surface Resistance 1.0×10⁴Ω to 1.0×10¹¹Ω
Certification RoHS
Services Accept OEM, ODM
Material Temperature Resistance
Material Bake Temperature Surface Resistance
PPE 125°C to Maximum 150°C 1.0×10⁴Ω to 1.0×10¹¹Ω
MPPO + Carbon Fiber 125°C to Maximum 150°C 1.0×10⁴Ω to 1.0×10¹¹Ω
MPPO + Carbon Powder 125°C to Maximum 150°C 1.0×10⁴Ω to 1.0×10¹¹Ω
MPPO + Glass Fiber 125°C to Maximum 150°C 1.0×10⁴Ω to 1.0×10¹¹Ω
PEI + Carbon Fiber Maximum 180°C 1.0×10⁴Ω to 1.0×10¹¹Ω
IDP Color 85°C 1.0×10⁶Ω to 1.0×10¹⁰Ω

Custom color, temperature, and other special requirements available upon request.

Applications
  • Package IC components
  • PCBA module components
  • Electronic component packaging
  • Optical device packaging
Product Images
Customized black ESD JEDEC IC tray showing precision-molded cavities for PCBA modules Close-up view of ESD JEDEC IC tray with matrix configuration holding electronic components
Frequently Asked Questions
How can I get a quotation?
Please provide detailed requirements for prompt quotation. Contact via Skype, Email, Phone, or WhatsApp for immediate response.
How long will it take to get a response?
We respond within 24 hours during working days.
What kind of service do we provide?
We offer IC tray design services based on your component specifications, providing one-stop solutions from design to packaging and shipping.
What are your terms of delivery?
We accept EXW, FOB, CIF, DDU, DDP, and other delivery terms for your convenience.
How to guarantee quality?
Our samples undergo strict testing, and finished products comply with international JEDEC standards to ensure 100% qualification rate.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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