Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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3 Inch Waffle Pack Bare Die Trays 44PCS with 32.98mm Pocket Size and 1.0x10⁴-1.0x10¹¹Ω Surface Resistance

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview
The 3-inch waffle pack bare die trays provide permanent anti-static protection for delicate electronic components. These environmentally friendly trays feature 44 pockets and maintain consistent performance across varying environmental conditions.
Key Features & Benefits
  • Permanent anti-static properties unaffected by time, temperature, or environment
  • Excellent mechanical strength and heat resistance
  • Superior impact resistance and chemical corrosion protection
  • Environmentally compliant with RoHS standards
  • Reusable and biodegradable design
  • Customizable sizes and configurations available
Technical Specifications
HN20105 Model Details
Parameter Specification
Material ESD PC Injection Molding
Color Black
Pocket Quantity 2×22 = 44 Pockets
Pocket Size 32.98×1.62×0.38mm
Surface Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Flatness Maximum 0.25mm
Available Sizes & Options
Outline Size Materials Surface Resistance Flatness Services
2-inch ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω Max 0.2mm OEM, ODM
3-inch ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω Max 0.25mm OEM, ODM
4-inch ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω Max 0.3mm OEM, ODM
Custom Sizes ABS, PC, PPE, etc. 1.0×10⁴ - 1.0×10¹¹ Ω TBC OEM, ODM
Applications
  • Wafer die, bar, and chip packaging
  • PCBA module component storage
  • Electronic component packaging
  • Optical device packaging
Company Advantages
  • 10+ years of export experience
  • Professional engineering team and efficient management
  • ISO certified factory with RoHS compliance
  • Support for small batch production
  • 24-hour professional sales support
  • Global export to USA, Germany, UK, Korea, Japan, and more
Customization & Services
We offer comprehensive OEM and ODM services with professional design capabilities. Custom samples are available based on your specific requirements.
Product Images
3-inch waffle pack bare die tray with 44 pockets for electronic components Close-up view of waffle pack tray showing individual component pockets

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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