Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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2-inch Waffle Pack IC Chip Tray - 80 PCS Capacity, 0.2mm Flatness, High Temperature Resistant

Price Negotiable
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
MOQ: 1000 pcs
Delivery Time: 5~8 working days
Brand: Hiner-pack
Product Description
Product Overview

Custom 2-inch waffle pack IC chip trays designed for high-value semiconductor devices, featuring precise cavity dimensions tailored to your specific chip size, thickness, and handling requirements.

Key Features & Benefits
High Temperature Resistance

Maintains structural integrity in 120℃-220℃ baking environments without deformation, ideal for semiconductor packaging and testing processes.

Superior Anti-Static Protection

Surface resistance of 1.0×10⁴-1.0×10¹¹Ω ensures static electricity elimination during production, packaging, and transportation.

Optimized Matrix Design

10×8 cavity configuration (80 PCS capacity) with edge chamfer design to prevent stacking errors and ensure proper placement orientation.

Material Durability

Constructed from PC, ABS, PPE materials with excellent mechanical strength, impact resistance, and chemical corrosion resistance.

Technical Specifications
Parameter Specification
Outline Size 50.7×50.7×4mm
Cavity Size 4.83×3.94×0.65mm
Matrix Quantity 10×8 = 80 PCS
Flatness MAX 0.2mm
Surface Resistance 1.0×10⁴-1.0×10¹¹Ω
Material Options PC, ABS, PPE, etc.
Color Customizable (Standard: Black)
Certification RoHS Compliant
Service Options OEM, ODM Available
Standard Size Specifications
Size Material Surface Resistance Flatness Color
2-inch ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.2mm Customizable
3-inch ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.25mm Customizable
4-inch ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω Max 0.3mm Customizable
Custom Size ABS, PC, PPE, etc. 1.0×10⁴-1.0×10¹¹Ω TBC Customizable
Applications
  • Semiconductor wafer die and bare wafer handling
  • Electronic components packaging and transportation
  • Optical electronic components protection
  • High-temperature automation equipment assembly
  • Production line turnover and storage operations
Product Images
2-inch waffle pack IC chip tray HN2078 model showing matrix cavity design Close-up view of 2-inch waffle pack IC tray cavities and edge chamfer design
Frequently Asked Questions
Can you do OEM and customized design IC trays?

We have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.

How long is your delivery time?

Typically 5-8 working days, depending on actual order quantities.

Do you provide samples? Is it free or extra?

Yes, we offer samples. Sample availability and cost depend on product value, with shipping costs typically collected or as agreed.

What kind of Incoterms can you do?

We support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and other incoterms as agreed.

What method can you help ship the goods?

By sea, air, express, mail, or post, depending on customer order quantity and volume requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hiner Technology Co., Ltd.
Location Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
Contact Person Zhu

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